R&D

Since its establishment in 2010, Shinkwang Chemical R&D CENTER has developed and mass-produced high-quality products required in the fields of display, mobile, electrical and electronic adhesives and coatings, and has been focusing on developing new products through continuous technology development.

R&D Center has the ability to develop various adhesives and coatings, including UV hardened resin, ordinary temperature-hardened and thermosetting urethane and epoxy, moisture-hardened denatured silicon, and DUAL CURE (UV+thermal Curing/UV+humidity Curing) resin. Based on its outstanding expertise, we strive to develop high-function and eco-friendly products.

Adhesives for camera modules for mobile and automotive electronic fields

Development of various types of adhesives applied to each part of the camera module for mobile camera modules and automotive electrical devices.

• - Various adhesives needed for camera modules can be developed.
• - Development and mass production of flange adhesive, lens adhesive, DUAL CURE adhesive for active alignment, IR filter adhesive, housing adhesive.
• - It has the ability to develop adhesives of UV hardening, thermal hardening, UV+ thermal hardening method according to each process.

Adhesives and coatings for LCD and OLED panels

Electrode Protector and SIDE SEAL Resin on Display Panel.

• - Development and mass-production of electrode protection agents that protect electrodes connecting ITO electrodes and ductile circuit boards from external environments.
• - Development and mass production of SIDE SEAL resin that prevents light glands and seals on display panels.
• - Has source technology related to oligomer synthesis and adhesive coatings with UV hardened resin.
• - Adhesives and coatings in related fields can be newly developed.

PCB Conformal Coated Resin

• - UV hardening is applied to improve the slow hardening speed of traditional silicone or dual-liquid urethane.
• - Development and mass production of UV+humidity Curing products
• - Obtain UL certification

Adhesive for semiconductors

High-performance adhesives used in semiconductor packages

• - Underfill for BGA, CSP, Flip chip packge
• - Capillary, Molded underfill adhesive development
• - Underfill development of dual curing (UV+ heating) system